JPH0469425B2 - - Google Patents

Info

Publication number
JPH0469425B2
JPH0469425B2 JP58109529A JP10952983A JPH0469425B2 JP H0469425 B2 JPH0469425 B2 JP H0469425B2 JP 58109529 A JP58109529 A JP 58109529A JP 10952983 A JP10952983 A JP 10952983A JP H0469425 B2 JPH0469425 B2 JP H0469425B2
Authority
JP
Japan
Prior art keywords
semiconductor element
conductive lead
protruding electrode
protruding
base film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58109529A
Other languages
English (en)
Japanese (ja)
Other versions
JPS601838A (ja
Inventor
Izumi Okamoto
Masayoshi Mihata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP58109529A priority Critical patent/JPS601838A/ja
Publication of JPS601838A publication Critical patent/JPS601838A/ja
Publication of JPH0469425B2 publication Critical patent/JPH0469425B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
JP58109529A 1983-06-17 1983-06-17 半導体装置 Granted JPS601838A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58109529A JPS601838A (ja) 1983-06-17 1983-06-17 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58109529A JPS601838A (ja) 1983-06-17 1983-06-17 半導体装置

Publications (2)

Publication Number Publication Date
JPS601838A JPS601838A (ja) 1985-01-08
JPH0469425B2 true JPH0469425B2 (en]) 1992-11-06

Family

ID=14512563

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58109529A Granted JPS601838A (ja) 1983-06-17 1983-06-17 半導体装置

Country Status (1)

Country Link
JP (1) JPS601838A (en])

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61195056U (en]) * 1985-05-25 1986-12-04
US4684975A (en) * 1985-12-16 1987-08-04 National Semiconductor Corporation Molded semiconductor package having improved heat dissipation
JPS6435925A (en) * 1987-07-30 1989-02-07 Mitsubishi Electric Corp Integrated circuit element
US4985747A (en) * 1988-06-09 1991-01-15 Oki Electric Industry Co., Ltd. Terminal structure and process of fabricating the same
JPH02161738A (ja) * 1988-12-15 1990-06-21 Hitachi Cable Ltd Ｔａｂ用テープキャリア

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5512791A (en) * 1978-07-14 1980-01-29 Nec Corp Semiconductor device

Also Published As

Publication number Publication date
JPS601838A (ja) 1985-01-08

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